? semiconductor components industries, llc, 2016 june, 2016 ? rev. 0 1 publication order number: ncp716b/d ncp716b wide input voltage low dropout, ultra-low iq regulator the ncp716b is 150 ma ldo linear voltage regulator. it is a very stable and accurate device with ultra?low ground current consumption (4.7 a over the full output load range) and a wide input voltage range (up to 24 v). the regulator incorporates several protection features such as thermal shutdown and current limiting. features ? operating input voltage range: 2.5 v to 24 v ? fixed voltage options available: 3.0 v and 5.0 v ? ultra low quiescent current: max. 4.7 a over temperature ? 2% accuracy over full temperature range ? noise: 115 v rms from 200 hz to 100 khz ? thermal shutdown and current limit protection ? available in tsop?5 package ? this is a pb?free device typical applicaitons ? portable equipment ? communication systems ? industrial measurement systems ? home automation devices figure 1. typical application schematic ncp716b vin vout gnd vin= (4 ? 24 v) vout = 3.0v, 5.0v/150 ma cin cout 1uf 1uf www. onsemi.com see detailed ordering, marking and shipping information in the package dimensions section on page 7 of this data sheet. ordering information marking diagram pin connections 1 5 tsop?5 case 483 1 5 xxxayw xxx = specific device code a = assembly location y = year w = work week = pb?free package (note: microdot may be in either location) 1 5 n/c tsop?5 (top view) n/c out in gnd
ncp716b www. onsemi.com 2 figure 2. simplified block diagram in out mosfet driver with current limit thermal shutdown eeprom uvlo gnd bandgap reference table 1. pin function description pin no. pin name description 1 out regulated output voltage pin. a small 1.0 f ceramic capacitor is needed from this pin to ground to assure stability. 2 gnd power supply ground. 3 in input pin. a small capacitor is needed from this pin to ground to assure stability. 4 n/c no connection. this pin can be tied to ground to improve thermal dissipation or left disconnected. 5 n/c no connection. this pin can be tied to ground to improve thermal dissipation or left disconnected. table 2. absolute maximum ratings rating symbol value unit input voltage (note 1) v in ?0.3 to 24 v output voltage v out ?0.3 to 6 v output short circuit duration t sc indefinite s maximum junction temperature t j(max) 150 c storage temperature t stg ?55 to 150 c esd capability, human body model (note 2) esd hbm 2000 v esd capability, machine model (note 2) esd mm 200 v stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. refer to electrical characteristics and application information for safe operating area. 2. this device series incorporates esd protection and is tested by the following methods: esd human body model tested per eia/jesd22?a114 esd machine model tested per eia/jesd22?a115 esd charged device model tested per eia/jesd22?c101e latchup current maximum rating tested per jedec standard: jesd78. table 3. thermal characteristics rating symbol value unit thermal characteristics, tsop?5 thermal resistance, junction?to?air r ja 250 c/w
ncp716b www. onsemi.com 3 table 4. electrical characteristics voltage version 3.0 v ?40 c t j 125 c; v in = 4.0 v; i out = 1 ma, c in = c out = 1.0 f, unless otherwise noted. typical values are at t j = +25 c. (note 5) parameter test conditions symbol min typ max unit operating input voltage v in 2.5 24 v output voltage accuracy ?40 c t j 125 c v out 2.94 3.0 3.06 v line regulation v out + 1 v v in 24 v, i out = 0.1 ma reg line 4 10 mv load regulation i out = 0.1 ma to 150 ma reg load 0.0013 0.007 %/ma dropout voltage (note 3) v out = 0.97 v out(nom) , i out = 150 ma v do 700 1100 mv maximum output current (note 6) i out 150 ma ground current i out = 0 ma, ?40 < t a < 125 c i gnd 3.2 4.7 a power supply rejection ratio v in = 4.0 v, v out = 3.0 v + 200 mvpp modulation i out = 1 ma, c out =10 f f = 100 khz psrr 55 db output noise voltage v out = 3.0 v, i out = 150 ma f = 100 hz to 100 khz v n 80 v rms thermal shutdown temperature (note 4) temperature increasing from t j = +25 c t sd 180 c thermal shutdown hysteresis (note 4) temperature falling from t sd t sdh ? 10 ? c 3. characterized when v out falls 3% below the nominal v out = 3.0 v 4. guaranteed by design and characterization. 5. performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at t j = t a = 25 c. low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible . 6. please follow the safe operating area. table 5. electrical characteristics voltage version 5.0 v ?40 c t j 125 c; v in = 6.0 v; i out = 1 ma, c in = c out = 1.0 f, unless otherwise noted. typical values are at t j = +25 c. (note 9) parameter test conditions symbol min typ max unit operating input voltage v in 2.5 24 v output voltage accuracy ?40 c t j 125 c v out 4.90 5.0 5.10 v line regulation v out + 1 v v in 24 v, i out = 0.1 ma reg line 4 10 mv load regulation i out = 0.1 ma to 150 ma reg load 0.0013 0.008 %/ma dropout voltage (note 7) v out = 0.97 v out(nom) , i out = 150 ma v do 600 955 mv maximum output current (note 10) i out 150 ma ground current i out = 0 ma, ?40 < t a < 125 c i gnd 3.2 4.7 a power supply rejection ratio v in = 6.0 v, v out = 5.0 v + 200 mvpp modulation i out = 1 ma, c out =10 f f = 100 khz psrr 53 db output noise voltage v out = 5.0 v, i out = 150 ma f = 100 hz to 100 khz v n 115 v rms thermal shutdown temperature (note 8) temperature increasing from t j = +25 c t sd 180 c thermal shutdown hysteresis (note 8) temperature falling from t sd t sdh ? 10 ? c 7. characterized when v out falls 3% below the nominal v out = 5.0 v 8. guaranteed by design and characterization. 9. performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at t j = t a = 25 c. low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible . 10. please follow the safe operating area.
ncp716b www. onsemi.com 4 typical characteristics 0 200 400 600 800 1000 0 25 50 75 125 150 0 200 400 600 800 1200 0 25 50 75 100 150 4.96 4.98 5.00 5.02 5.04 5.06 0 25 50 75 100 125 150 figure 3. output voltage vs. temperature figure 4. output voltage vs. temperature figure 5. output voltage vs. output current figure 6. output voltage vs. output current figure 7. dropout voltage vs. output current figure 8. dropout voltage vs. output current ?40 ?20 0 20 40 60 80 temperature ( c) output voltage (v) temperature ( c) output voltage (v) 5.02 ?40 ?20 0 20 40 60 80 3.02 0 25 125 50 75 100 150 output current (ma) output voltage (v) output current (ma) output voltage (v) output current (ma) dropout voltage (mv) output current (ma) dropout voltage (mv) 3.016 3.012 3.008 3.004 3.000 5.01 5.00 4.99 4.98 4.97 3.01 3.00 2.99 2.98 2.97 ncp716bsn300t1g c in = c out = 1 f i out = 1 ma v in = 4.0 v to 24 v v in = 6.0 v v in = 8.0 to 24 v ncp716bsn300t1g c in = c out = 1 f t a = 25 c v in = 4.0 v v in = 5.0 v v in = 10 v v in = 15 v v in = 20 v v in = 24 v v in = 6.0 v v in = 10 v v in = 15 v v in = 20 v v in = 24 v NCP716BSN500T1G c in = c out = 1 f t a = 25 c ncp716bsn300t1g c in = c out = 1 f 125 t a = ?40 c t a = 25 c t a = 125 c NCP716BSN500T1G c in = c out = 1 f t a = ?40 c t a = 25 c t a = 125 c 100 100 120 2.996 100 120 1000
ncp716b www. onsemi.com 5 typical characteristics 0 4 8 12 16 20 0 5 10 15 20 25 figure 9. ground current vs. input voltage figure 10. ground current vs. input voltage input voltage (v) ground current ( a) input voltage (v) quiescent current ( a) 0 4 8 12 16 20 0 5 10 15 20 25 0 0.5 1.0 1.5 2.0 2.5 3.0 4.0 4.5 10 100 1k 10k 100k 1m figure 11. spectral noise density vs. frequency frequency (hz) noise density ( v/ hz ) 0 1 2 3 4 5 6 7 10 100 1k 10k 100k 1m figure 12. spectral noise density vs. frequency frequency (hz) noise density ( v/ hz ) 0 20 40 60 80 100 figure 13. psrr vs. frequency frequency (hz) psrr (db) 0 20 40 60 80 100 10 100 1k 10k 100k 1m figure 14. psrr vs. frequency frequency (hz) psrr (db) ncp716bsn300t1g v in = 4 v c in = c out = 1 f i out = 150 ma t a = 25 c ncp716bsn300t1g c in = c out = 1 f t a = 25 c NCP716BSN500T1G c in = c out = 1 f t a = 25 c 10 100 1k 10k 100k 1m i out = 0 i out = 50 ma i out = 150 ma 3.5 NCP716BSN500T1G v in = 6 v c in = c out = 1 f i out = 150 ma t a = 25 c i out = 0 i out = 50 ma i out = 150 ma i out = 50 ma i out = 10 ma i out = 1 ma i out = 50 ma i out = 10 ma i out = 1 ma ncp716bsn300t1g v in = 4 v + 200 mvpp modulation c out = 10 f NCP716BSN500T1G v in = 6 v + 200 mvpp modulation c out = 10 f
ncp716b www. onsemi.com 6 typical characteristics figure 15. line transient response figure 16. line transient response figure 17. load transient response figure 18. load transient response figure 19. turn?on response figure 20. turn?on response
ncp716b www. onsemi.com 7 applications information the ncp716b is the member of new family of w ide input voltage range low dropout regulators which delivers ultra low ground current consumption, good noise and power supply rejection ratio performance. input decoupling (c in ) it is recommended to connect at least 1.0 f ceramic x5r or x7r capacitor between in and gnd pin of the device. this capacitor will provide a low impedance path for any unwanted ac signals or noise superimposed onto constant input voltage. the good input capacitor will limit the influence of input trace inductances and source resistance during sudden load current changes. higher capacitance and lower esr capacitors will improve the overall line transient response. output decoupling (c out ) the ncp716b does not require a minimum equivalent series resistance (esr) for the output capacitor. the device is designed to be stable with standard ceramics capacitors with values of 1.0 f or greater up to 10 f. the x5r and x7r types have the lowest capacitance variations over temperature thus they are recommended. power dissipation and heat sinking the maximum power dissipation supported by the device is dependent upon board design and layout. mounting pad configuration on the pcb, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. the maximum power dissipation the ncp716b can handle is given by: p d(max) t j(max) t a r ja (eq. 1) the power dissipated by the ncp716b for given application conditions can be calculated from the following equations: p d v in i gnd (i out ) i out v in v out (eq. 2) or v in(max) p d(max) v out
i out i out i gnd (eq. 3) for reliable operation, junction temperature should be limited to +125 c maximum. hints v in and gnd printed circuit board traces should be as wide as possible. when the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. place external components, especially the output capacitor, as close as possible to the ncp716b, and make traces as short as possible . ordering information device voltage option marking package shipping ? ncp716bsn300t1g 3.0 v 6aa tsop?5 (pb?free) 3000 / tape & reel NCP716BSN500T1G 5.0 v 6av tsop?5 (pb?free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
ncp716b www. onsemi.com 8 package dimensions tsop?5 case 483 issue l notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dimension a. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a 3.00 bsc b 1.50 bsc c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 m 0 10 s 2.50 3.00 123 54 s a g b d h c j 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 c seating plane 0.05 k m detail z detail z top view side view a b end view on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 ncp716b/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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